Semicera's 2~6 inch 4° off-angle P-type 4H-SiC substrates ka emebere iji gboo mkpa na-eto eto nke ike na-arụ ọrụ dị elu yana ndị na-emepụta ngwaọrụ RF. Ntuzi aka n'akụkụ 4° na-eme ka uto epitaxial kachasị mma, na-eme ka mkpụrụ a bụrụ ezigbo ntọala maka ọtụtụ ngwaọrụ semiconductor, gụnyere MOSFET, IGBT na diodes.
Nke a 2 ~ 6 inch 4 ° off-angle P-type 4H-SiC substrate nwere ihe onwunwe magburu onwe ya, gụnyere elu okpomọkụ conductivity, ezigbo ọkụ eletrik, na nkwụsi ike n'ibu. Ntuzi aka n'akụkụ anya na-enyere aka belata njupụta micropipe ma na-akwalite akwa epitaxial dị nro, nke dị oke mkpa iji melite arụmọrụ na ntụkwasị obi nke ngwaọrụ semiconductor ikpeazụ.
Semicera's 2 ~ 6 inch 4° off-angle P-type 4H-SiC substrates dị n'ụdị dayameta dị iche iche, sitere na sentimita 2 ruo 6 sentimita, iji zute ihe nrụpụta dị iche iche. A na-emezi mkpụrụ anyị nke ọma iji nye ọkwa doping edo edo na njirimara elu dị elu, na-ahụ na wafer ọ bụla na-ezute nkọwa siri ike achọrọ maka ngwa eletrọnịkị dị elu.
Nkwenye nke Semicera maka imepụta ihe ọhụrụ na ịdị mma na-eme ka o doo anya na 2 ~ 6 inch 4 ° off-angle P-type 4H-SiC substrates na-ebuga arụmọrụ na-agbanwe agbanwe n'ọtụtụ ngwa sitere na ngwa elektrọnik gaa na ngwaọrụ dị elu. Ngwaahịa a na-enye ihe ngwọta a pụrụ ịdabere na ya maka ọgbọ na-esote nke ike na-arụ ọrụ nke ọma, semiconductor na-arụ ọrụ dị elu, na-akwado ọganihu nkà na ụzụ na ụlọ ọrụ dị ka ụgbọala, telecommunications, na ume ọhụrụ.
Ụkpụrụ metụtara nha
Nha | 2-anụ ọhịa | 4-anụ ọhịa |
Dayameta | 50.8 mm± 0.38 mm | 100.0 mm + 0/-0.5 mm |
Nhazi elu | 4° chere ihu <11-20>±0.5° | 4° chere ihu <11-20>±0.5° |
Ogologo Flat nke izizi | 16.0 mm± 1.5mm | 32.5mm ± 2mm |
Ogologo Flat nke abụọ | 8.0 mm± 1.5mm | 18.0 mm ± 2 mm |
Nhazi Flat nke izizi | Parallelto <11-20>±5.0° | Parallelto <11-20>±5.0c |
Nhazi Flat nke abụọ | 90°CW site na isi ± 5.0°, silicon ihu elu | 90°CW site na isi ± 5.0°, silicon ihu elu |
Emecha elu elu | C-Ihu: Ngwa anya Polish, Si-Ihu: CMP | C-Ihu: OpticalPolish, Si-Ihu: CMP |
Wafer Edge | Beveling | Beveling |
Ọdịdị dị n'elu | Si-Face Ra <0.2 nm | Si-Face Ra <0.2nm |
Ọkpụrụkpụ | 350.0± 25.0um | 350.0± 25.0um |
Ụdị poly | 4H | 4H |
Doping | p-Ụdị | p-Ụdị |
Ụkpụrụ metụtara nha
Nha | 6-anụ ọhịa |
Dayameta | 150.0 mm + 0/-0.2 mm |
Ntuzi ihu ihu | 4° chere ihu <11-20>±0.5° |
Ogologo Flat nke izizi | 47.5 mm ± 1.5mm |
Ogologo Flat nke abụọ | Ọ dịghị |
Nhazi Flat nke izizi | Yiri na <11-20>±5.0° |
Usoro nke abụọ Flat | 90°CW site na isi ± 5.0°, silicon chere ihu |
Emecha elu elu | C-Ihu: Ngwa anya Polish, Si-Ihu:CMP |
Wafer Edge | Beveling |
Ọdịdị dị n'elu | Si-Face Ra <0.2 nm |
Ọkpụrụkpụ | 350.0± 25.0μm |
Ụdị poly | 4H |
Doping | p-Ụdị |