Ọmụmụ ihe na semiconductor dieusoro njikọ, gụnyere usoro nrapado, usoro eutectic bonding, soft solder bonding process, silver sintering bonding process, hot pressing bonding process, flip chip bonding process. A na-ewebata ụdị dị iche iche na ihe ngosi teknụzụ dị mkpa nke ihe eji arụ ọrụ na-anwụ anwụ, a na-enyocha ọnọdụ mmepe, a na-atụkwa anya mmepe mmepe.
1 Nchịkọta nke ụlọ ọrụ semiconductor na nkwakọ ngwaahịa
Ụlọ ọrụ semiconductor gụnyere kpọmkwem ihe na akụrụngwa semiconductor dị elu, nrụpụta nke etiti etiti, yana ngwa ala. Ụlọ ọrụ semiconductor nke obodo m malitere n'oge, ma mgbe ihe fọrọ nke nta ka ọ bụrụ afọ iri nke mmepe ngwa ngwa, obodo m aghọwo ahịa ahịa ngwaahịa semiconductor kasị ukwuu n'ụwa na ahịa akụrụngwa semiconductor kasị ukwuu n'ụwa. Ụlọ ọrụ semiconductor na-etolite ngwa ngwa n'ụdị otu ọgbọ nke akụrụngwa, otu ọgbọ nke usoro, na otu ọgbọ nke ngwaahịa. Nnyocha na usoro semiconductor na akụrụngwa bụ isi ihe na-anya ụgbọ ala maka ọganihu na-aga n'ihu nke ụlọ ọrụ na nkwa maka mmepụta mmepụta na mmepụta nke ngwaahịa semiconductor.
Akụkọ mmepe nke teknụzụ nkwakọ ngwaahịa semiconductor bụ akụkọ ihe mere eme nke nkwalite mgbawa na-aga n'ihu na miniaturization nke sistemu. Ike dị n'ime nke teknụzụ nkwakọ ngwaahịa esila n'ọhịa nke smartphones dị elu gaa n'ọhịa dị ka kọmpụta dị elu na ọgụgụ isi. E gosipụtara usoro anọ nke mmepe teknụzụ nkwakọ ngwaahịa semiconductor na Tebụl 1.
Ka ọnụ ọgụgụ usoro lithography semiconductor na-aga n'ihu 10 nm, 7 nm, 5 nm, 3 nm, na 2 nm, R&D na ọnụ ahịa mmepụta na-aga n'ihu na-ebili, ọnụego mkpụrụ na-ebelata, na Iwu Moore na-ebelata. Site n'echiche nke usoro mmepe ụlọ ọrụ mmepụta ihe, nke a na-egbochi ugbu a site na njedebe anụ ahụ nke transistor density na nnukwu mmụba nke ọnụ ahịa mmepụta ihe, nkwakọ ngwaahịa na-etolite na ntụziaka nke miniaturization, njupụta dị elu, arụmọrụ dị elu, ọsọ ọsọ, nnukwu ugboro, na ntinye dị elu. Ụlọ ọrụ semiconductor abanyela na post-Moore, na usoro ndị dị elu anaghịzi elekwasị anya na ọganihu nke teknụzụ na-emepụta wafer, ma jiri nwayọọ nwayọọ na-atụgharị na nkà na ụzụ nkwakọ ngwaahịa dị elu. Teknụzụ nkwakọ ngwaahịa dị elu nwere ike ọ bụghị naanị ịkwalite ọrụ yana ịbawanye uru ngwaahịa, kamakwa belata ọnụ ahịa nrụpụta nke ọma, bụrụ ụzọ dị mkpa iji gaa n'ihu n'iwu Moore. N'otu aka ahụ, a na-eji teknụzụ bụ isi ihe na-ekewa usoro mgbagwoju anya n'ime teknụzụ nkwakọ ngwaahịa dị iche iche nke enwere ike itinye ya na nkwakọ ngwaahịa dị iche iche na nke dị iche iche. N'aka nke ọzọ, a na-eji teknụzụ usoro ihe eji eme ihe na-ejikọta ngwaọrụ nke ihe dị iche iche na ihe dị iche iche, nke nwere uru ọrụ pụrụ iche. A na-enweta njikọ nke ọtụtụ ọrụ na ngwaọrụ nke ihe dị iche iche site na iji teknụzụ microelectronics, na mmepe sitere na sekit jikọtara ọnụ na usoro nhazi.
Nkwakọ ngwaahịa Semiconductor bụ mmalite maka nrụpụta mgbawa na akwa dị n'etiti ụwa nke mgbawa na sistemụ mpụga. Ka ọ dị ugbu a, na mgbakwunye na nkwakọ ngwaahịa semiconductor ọdịnala na ụlọ ọrụ nnwale, semiconductorwaferntọala, ụlọ ọrụ imewe semiconductor, yana ụlọ ọrụ akụrụngwa agbakwunyere na-arụsi ọrụ ike na-emepe emepe nkwakọ ngwaahịa dị elu ma ọ bụ teknụzụ nkwakọ ngwaahịa nwere njikọ.
Isi usoro nke teknụzụ nkwakọ ngwaahịa ọdịnala bụwaferthinning, ịcha, anwụ bonding, waya bonding, plastic sealing, electroplating, ọgịrịga ịkpụ na ịkpụzi, wdg N'ime ha, ndị anwụ bonding usoro bụ otu n'ime ndị kasị mgbagwoju na oké egwu nkwakọ usoro, na anwụ bonding ngwá ọrụ bụkwa otu n'ime ha. akụrụngwa kachasị dị mkpa na nkwakọ ngwaahịa semiconductor, ma bụrụ otu n'ime akụrụngwa nkwakọ ngwaahịa nwere ọnụ ahịa ahịa kachasị elu. Ọ bụ ezie na teknụzụ nkwakọ ngwaahịa dị elu na-eji usoro njedebe dị n'ihu dị ka lithography, etching, metallization, na planarization, usoro nkwakọ ngwaahịa kacha mkpa ka bụ usoro njikọ anwụ.
2 Semiconductor anwụ bonding usoro
2.1 Nchịkọta
A na-akpọkwa usoro njikọ nke anwụ anwụ, ntinye mgbawa, ntinye isi, die bonding, mgbawa usoro, wdg. A na-egosi usoro njikọ nke anwụ na Figure 1. N'ikwu okwu n'ozuzu, ịnwụ anwụ bụ iji bulie mgbawa site na wafer site na iji isi ịgbado ọkụ. nozzle mmiri ara ehi na-eji oghere, ma tinye ya na ebe a na-ahụ maka mpe mpe akwa nke eriri ndu ma ọ bụ nkwakọ ngwaahịa n'okpuru nduzi anya, nke mere na mgbawa na mpe mpe akwa na-ejikọta ma dozie ya. Ịdị mma na arụmọrụ nke usoro njikọ anwụ ga-emetụta kpọmkwem àgwà na arụmọrụ nke njikọ waya na-esote, ya mere ịnwụ anwụ bụ otu n'ime teknụzụ ndị bụ isi na usoro azụ azụ semiconductor.
Maka usoro nkwakọ ngwaahịa dị iche iche nke semiconductor, enwere teknụzụ usoro njikọ isi anwụ isii ugbu a, ya bụ nrapado bonding, eutectic bonding, soft solder bonding, silver sintering bonding, hot pressing bonding, and flip-chip bonding. Iji nweta ezigbo njikọ mgbawa, ọ dị mkpa iji mee ka usoro ihe ndị dị na ya na-arụkọ ọrụ ọnụ na-emekọ ihe ọnụ, karịsịa gụnyere ihe mkpuchi anwụ, okpomọkụ, oge, nrụgide na ihe ndị ọzọ.
2. 2 Nrapado usoro
N'oge nrapado bonding, a ụfọdụ ego nke nrapado kwesịrị ka etinyere na ndu frame ma ọ bụ ngwugwu mkpụrụ tupu etinye mgbawa, na mgbe ahụ, anwụ bonding isi na-eburu mgbawa, na site na igwe n'ọhụụ nduzi, a na-etinye mgbawa n'ụzọ ziri ezi na bonding. ọnọdụ nke ndu etiti ma ọ bụ ngwugwu mkpụrụ nke ejiri nrapado kpuchie, na ụfọdụ ike ịnwụ anwụ na-etinye aka na mgbawa site na isi igwe anwụ anwụ, na-akpụ akwa nrapado n'etiti mgbawa na etiti ndu ma ọ bụ ngwugwu ngwugwu, ka o wee nweta nzube nke bonding, wụnye na idozi mgbawa. A na-akpọkwa usoro njikọ njikọ anwụ a n'ihi na ọ dị mkpa ka a na-etinye nrapado n'ihu igwe na-ejikọta anwụ.
Adhesives ndị a na-ejikarị gụnyere ihe semiconductor dị ka resin epoxy na paste ọlaọcha na-eduzi. Adhesive bonding bụ ihe a na-ejikarị eme ihe na semiconductor chip die bonding usoro n'ihi na usoro ahụ dịtụ mfe, ọnụ ahịa ya dị ala, a pụkwara iji ihe dị iche iche mee ihe.
2.3 Eutectic bonding usoro
N'oge eutectic bonding, eutectic bonding ihe na-adịkarị tupu etinyere na ala nke mgbawa ma ọ bụ ụzọ ndu. Ngwa eutectic bonding na-ebuli mgbawa ahụ ma na-eduzi ya site na usoro ọhụụ igwe iji tinye mgbawa ahụ n'ụzọ ziri ezi n'ọnọdụ njikọ njikọ kwekọrọ na etiti ndu. Ihe mgbawa na etiti ndu na-etolite eutectic bonding interface n'etiti mgbawa na ngwugwu ngwugwu n'okpuru ngwakọta nke kpo oku na nrụgide. A na-ejikarị usoro njikọ eutectic eme ihe na etiti ndu na nkwakọ ngwaahịa seramiiki.
Eutectic bonding ihe na-adịkarị agwakọta site na ihe abụọ na a ụfọdụ okpomọkụ. Ihe ndị a na-ejikarị eme ihe gụnyere ọla edo na tin, ọla edo na silicon, wdg. Mgbe ị na-eji usoro njikọ eutectic, modul nnyefe egwu ebe etiti ụzọ dị ga-ebu ụzọ kpoo etiti ahụ. Isi ihe na-eme ka a mata usoro njikọ eutectic bụ na eutectic bonding ihe nwere ike gbazee na okpomọkụ dị n'okpuru ebe mgbaze nke ihe abụọ mejupụtara iji mepụta njikọ. Iji gbochie okpokolo agba ka oxidized n'oge eutectic bonding usoro, eutectic bonding usoro na-ejikarị gas nchebe dị ka hydrogen na nitrogen agwakọta gas na-etinye n'ime track iji chebe ndu ndú.
2. 4 Soft solder bonding usoro
Mgbe a na-ejikọta ihe na-ere ihe dị nro, tupu itinye mgbawa ahụ, a na-etinye ọnọdụ njikọ dị na etiti ndu, ma ọ bụ tin okpukpu abụọ, na etiti ndu kwesịrị ikpo ọkụ na egwu ahụ. Uru nke usoro nchikota solder dị nro bụ ezigbo conductivity thermal, na mwepu bụ na ọ dị mfe oxidize na usoro ahụ dị mgbagwoju anya. Ọ dabara maka nkwakọ ngwaahịa igwe ọkụ, dị ka nkwakọ ngwaahịa transistor.
2. 5 Silver sintering bonding usoro
Usoro njikọ njikọ kachasị mma maka mgbawa semiconductor nke ọgbọ nke atọ ugbu a bụ iji teknụzụ sntering metal, nke na-agwakọta polymers dị ka epoxy resin maka njikọ na gluu na-eduzi. Ọ nwere ezigbo ọkụ eletrik, conductivity thermal, yana njirimara ọrụ okpomọkụ dị elu. Ọ bụkwa teknụzụ bụ isi maka ọganiihu na nkwakọ ngwaahịa semiconductor ọgbọ nke atọ n'afọ ndị na-adịbeghị anya.
2.6 Usoro njikọ nke thermocompression
N'ime ngwa nkwakọ ngwaahịa nke sekit jikọtara akụkụ atọ dị elu, n'ihi mbelata nke mgbawa ntinye / mmepụta ihe na-aga n'ihu, nha nha na pitch, ụlọ ọrụ semiconductor Intel ewepụtala usoro njikọ njikọ thermocompression maka ngwa njikọ njikọ olulu dị elu, obere njikọ. mgbawa ibe nwere pitch nke 40 ruo 50 μm ma ọ bụ ọbụna 10 μm. Usoro njikọ nke thermocompression dabara adaba maka ngwa mgbawa-to-wafer na mgbawa-na-substrate. Dị ka a ngwa ngwa multi-nzọụkwụ usoro, thermocompression bonding usoro na-eche ihe ịma aka na usoro njikwa okwu, dị ka okpomọkụ na-enweghị isi na-enweghị nchịkwa na-agbaze nke obere olu solder. N'oge njikọta thermocompression, okpomọkụ, nrụgide, ọnọdụ, wdg ga-enwerịrị ihe achọrọ njikwa.
2.7 Tụgharịa usoro njikọ njikọ
A na-egosi ụkpụrụ nke usoro njikọ njikọ tụgharịa na eserese 2. Usoro ntụgharị na-ebuli mgbawa na wafer wee tụgharịa ya 180 ° iji nyefee mgbawa. Isi nozzle na-ebuli mgbawa ahụ site na usoro ntụgharị, na ntụzịaka nke mgbawa ahụ na-agbada. Mgbe isi igwe ịgbado ọkụ gafere n'elu nke nkwakọ ngwaahịa, ọ na-aga n'ala iji jikọta ma dozie mgbawa na mkpụrụ nkwakọ ngwaahịa.
Ngwunye mgbawa mgbawa bụ teknụzụ njikọ njikọ mgbawa dị elu ma bụrụkwa ụzọ mmepe nke teknụzụ nkwakọ ngwaahịa dị elu. Ọ nwere njirimara nke njupụta dị elu, arụmọrụ dị elu, dị gịrịgịrị na mkpụmkpụ, ma nwee ike izute ihe mmepe nke ngwaahịa eletrọnịkị ndị ahịa dị ka smartphones na mbadamba. Usoro ijikọ mgbawa ahụ na-eme ka nkwakọ ngwaahịa dị ala ma nwee ike ịghọta ibe edokọbara na ngwugwu akụkụ atọ. A na-ejikarị ya na mpaghara teknụzụ nkwakọ ngwaahịa dị ka 2.5D / 3D integrated nkwakọ, wafer-larịị nkwakọ, na usoro-larịị nkwakọ. Usoro nchikota nke flip chip bụ nke a na-ejikarị na nke a na-ejikarị eme ihe siri ike ọnwụ bonding na teknụzụ nkwakọ ngwaahịa dị elu.
Oge nzipu: Nov-18-2024