Kedu usoro ndị bụ isi na nhazi nke ala SiC?

Otu anyị si ewepụta usoro nhazi maka ihe ndị SiC bụ ndị a:

1. Crystal Orientation: Iji X-ray diffraction na-atụgharị kristal ingot.Mgbe a na-eduzi ọkụ X-ray n'ihu kristal achọrọ, akụkụ nke oghere a gbasasịrị na-ekpebi ntụgharị kristal.

2. Ngwunye dayameta dị n'èzí: Otu kristal toro na graphite crucibles na-agafekarị dayameta ọkọlọtọ.Ngwuri dayameta dị n'èzí na-ebelata ha na nha ọkọlọtọ.

Ngwucha ihu ngwụcha: 4-inch 4H-SiC substrates na-enwekarị ihu n'ọnọdu abụọ, isi na nke abụọ.Egweri ihu ngwụcha na-emepe akụkụ ndokwa ndị a.

3. Ịwa Waya: Ịwa waya bụ nzọụkwụ dị oké mkpa na nhazi 4H-SiC substrates.Ihe mgbawa na okpuru ala mebiri emebi n'oge ịwa waya na-emetụta usoro ndị na-esote, na-agbatị oge nhazi ma na-akpata ọnwụ ihe.Usoro a na-ahụkarị bụ ịwa osisi ọtụtụ waya na abrasive diamond.A na-eji mmegharị na-emegharị nke wires ọla jikọtara ya na abrasives diamond iji belata ingot 4H-SiC.

4. Chamfering: Iji gbochie ihu chipping na ibelata consumable losses n'oge ụdi Filiks, nkọ n'ọnụ nke waya-sawn ibe na-chamfered ka kpọmkwem shapes.

5. Thinning: Waya sawing na-ahapụ ọtụtụ ọkọ na sub-elu-emebi.A na-eme mkparị site na iji wiil diamond wepụ ntụpọ ndị a dị ka o kwere mee.

6. Na-egweri: Usoro a na-agụnye ihe siri ike na-egweri nke ọma na-eji obere boron carbide ma ọ bụ diamond abrasives na-ewepụ ihe ndị fọdụrụnụ na mmebi ọhụrụ ewepụtara n'oge thinning.

7. Ndozi: Nzọụkwụ ikpeazụ na-agụnye polishing siri ike na ezigbo polishing site na iji alumina ma ọ bụ silicon oxide abrasives.Mmiri na-egbuke egbuke na-eme ka elu ahụ dị nro, nke a na-ewepụ ya site na abrasives.Nzọụkwụ a na-eme ka ihu dị larịị na nke adịghị emebi emebi.

8. Nhicha: Wepụ ihe ndị dị n'ime, ọla, ihe nkiri oxide, ihe ndị na-emepụta ihe na ihe ndị ọzọ na-emerụ emerụ na-ahapụ site na nhazi usoro.