Otu anyị si ewepụta usoro nhazi maka ihe ndị SiC bụ ndị a:
1. Crystal Orientation: Iji X-ray diffraction na-atụgharị kristal ingot. Mgbe a na-eduzi ọkụ X-ray n'ihu kristal achọrọ, akụkụ nke oghere a gbasasịrị na-ekpebi ntụgharị kristal.
2. Ngwunye dayameta dị n'èzí: Otu kristal toro na graphite crucibles na-agafekarị dayameta ọkọlọtọ. Ngwuri dayameta dị n'èzí na-ebelata ha ka ha bụrụ nha ọkọlọtọ.
3.End Face egweri: 4-inch 4H-SiC substrates a nwere abụọ n'ọnọdu n'ọnụ, isi na nke abụọ. Egweri ihu ngwụcha na-emepe akụkụ ndokwa ndị a.
4. Waya Ịwa: Waya sawing bụ a dị oké mkpa nzọụkwụ na nhazi 4H-SiC substrates. Ihe mgbawa na okpuru ala mebiri emebi n'oge ịwa waya na-emetụta usoro ndị na-esote, na-agbatị oge nhazi ma na-akpata ọnwụ ihe. Usoro a na-ahụkarị bụ ịwa osisi ọtụtụ waya na abrasive diamond. A na-eji mmegharị na-emegharị nke wires ọla jikọtara ya na abrasives diamond iji belata ingot 4H-SiC.
5. Chamfering: Iji gbochie ihu chipping na ibelata consumable losses n'oge ụdi Filiks, nkọ n'ọnụ nke waya-sawn ibe na-chamfered ka kpọmkwem shapes.
6. Thinning: Waya sawing na-ahapụ ọtụtụ ọkọ na sub-elu emebi. A na-eme mkparị site na iji wiil diamond wepụ ntụpọ ndị a dị ka o kwere mee.
7. Egweri: Usoro a na-agụnye ịhịa aka siri ike na nke ọma na-eji obere boron carbide ma ọ bụ diamond abrasives na-ewepụ ihe ndị fọdụrụnụ na mmebi ọhụrụ ewepụtara n'oge thinning.
8. Ndozi: Nzọụkwụ ikpeazụ na-agụnye polishing siri ike na ezigbo polishing site na iji alumina ma ọ bụ silicon oxide abrasives. Mmiri na-egbuke egbuke na-eme ka elu ahụ dị nro, nke a na-ewepụ ya site na abrasives. Nzọụkwụ a na-eme ka ihu dị larịị na nke adịghị emebi emebi.
9. Nhicha: Wepụ ihe ndị dị n'ime, ọla, ihe nkiri oxide, organic residues, na ihe ndị ọzọ na-emerụ emerụ na-ahapụ site na nhazi usoro.
Oge nzipu: Mee-15-2024